The new Thermo Scientific Helios 5 DualBeam builds on the high-performance imaging and analysis capabilities of the industry-leading Helios DualBeam family. It is carefully designed to meet the needs of materials science researchers and engineers for the widest range of FIB-SEM use cases – even on the most challenging samples.

The Helios 5 DualBeam redefines the standard in high-resolution imaging with highest materials contrast; fastest, easiest and most precise high-quality sample preparation for S/TEM imaging and Atom Probe Tomography (APT) as well as the highest-quality subsurface and 3D characterization. 

Register for our recorded webinar (~17 minutes) and learn how additional advancements to the new Helios 5 were designed to ensure the system is optimized for a variety of manual or automated workflows.

Who should attend?

  • Researchers and engineers working in interdisciplinary research fields related to materials science.

Why should you attend?

  • Discover how greater ease-of-use makes Helios 5 is the most accessible DualBeam for users of all experience levels.
  • Learn how advanced automation capabilities, increased robustness and stability enhancements in the Helios 5 and AutoTEM 5 software can significantly increase the sample preparation throughput by allowing unattended and even overnight operation. 

Speaker biography


Brandon van Leer
Product Marketing Engineer SEM / DualBeam
Thermo Fisher Scientific

Brandon Van Leer joined Thermo Fisher Scientific in late 2004 as a Senior Applications Engineer after his tenure at Hewlett Packard as a Materials Engineer in the Imaging and Printing Group. He then led the North American SEM, FIB and Small DualBeam applications team for a number of years. Currently, Brandon is acting as a business development and product marketing engineer for the Materials Science Business Unit. Brandon’s professional background has focused largely on materials characterization and development of electronic materials and polymers. He has over 15 years of experience with various analytical techniques and for over 9 years has concentrated on applications for SEM and FIB. Brandon’s current research interests are in nanoscale fabrication of 3D structures using FIB technology. Brandon received his BS in Physics (1988) and his MS in Electrical Engineering (2002) from Oregon State University. He is a member of MSA, MRS and IEEE.

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